24-6554-16

Aries Electronics

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24-6554-16

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CONN IC DIP SOCKET ZIF 24POS

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In Stock : 139

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Contact Finish - Mating	Nickel Boron
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	24 (2 x 12)
Contact Finish Thickness - Post	50.0µin (1.27µm)
Pitch - Post	0.100" (2.54mm)
Series	55
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Nickel Boron
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Closed Frame
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	24-655