10150095-3200RLF

Amphenol ICC (FCI)

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10150095-3200RLF

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CONN MICROSPEED 1.00MM BOARD-

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Insulation Height	0.207" (5.25mm)
Ingress Protection	-
Voltage Rating	100VAC
Current Rating (Amps)	1A per Contact
Contact Finish Thickness - Mating	3.94µin (0.100µm)
Contact Type	Female Socket
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Copper Alloy
Connector Type	Receptacle
Mfr	Amphenol ICC (FCI)
Style	Board to Board
Pitch - Mating	0.039" (1.00mm)
Features	Board Guide, Solder Retention
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	32
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Surface Mount, Right Angle
Contact Finish Thickness - Post	78.7µin (2.00µm)
Insulation Material	Liquid Crystal Polymer (LCP), Glass Filled
Series	Minitek® MicroSpeed
Contact Shape	Square
Row Spacing - Mating	0.059" (1.50mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	-
Number of Positions Loaded	All
Package	Tape & Reel (TR)
Mated Stacking Heights	-
Base Product Number	10150095