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TS991SNL35T4
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TS991SNL35T4

Chip Quik Inc.

Producto No:

TS991SNL35T4

Fabricante:

Chip Quik Inc.

Paquete:

-

Lote:

-

Ficha de datos:

pdf

Descripción:

THERMALLY STABLE SOLDER PASTE NC

Cantidad:

Entrega:

1.webp 4.webp 5.webp 2.webp 3.webp

Pago:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

En stock : Por favor investigación

Por favor envíe RFQ, responderemos inmediatamente.

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Información del producto

Parámetro Info

Guía del usuario

Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form Syringe, 1.23 oz (34.869g)
Process -
Wire Gauge -
Product Status Active
Weight -
Flux Type No-Clean
Series CHIPQUIK®
Type Solder Paste
Mesh Type 4
Shelf Life Start Date of Manufacture
Shipping Info -
Mfr Chip Quik Inc.
Package Bulk
Shelf Life 12 Months
Diameter -
Melting Point 423°F (217°C)