
Chip Quik Inc.
Producto No:
TS991SNL35T4
Fabricante:
Paquete:
-
Lote:
-
Descripción:
THERMALLY STABLE SOLDER PASTE NC
Cantidad:
Entrega:

Pago:
Por favor envíe RFQ, responderemos inmediatamente.

| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Form | Syringe, 1.23 oz (34.869g) |
| Process | - |
| Wire Gauge | - |
| Product Status | Active |
| Weight | - |
| Flux Type | No-Clean |
| Series | CHIPQUIK® |
| Type | Solder Paste |
| Mesh Type | 4 |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Mfr | Chip Quik Inc. |
| Package | Bulk |
| Shelf Life | 12 Months |
| Diameter | - |
| Melting Point | 423°F (217°C) |