TS391SNL500C
Chip Quik Inc.
Producto No:
TS391SNL500C
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
THERMALLY STABLE SOLDER PASTE NO
Cantidad:
Entrega:
Pago:
En stock : Por favor investigación
Por favor envíe RFQ, responderemos inmediatamente.
Información del producto
Parámetro Info
Guía del usuario
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Form | Cartridge, 17.64 oz (500g) |
| Process | Lead Free |
| Wire Gauge | - |
| Product Status | Active |
| Flux Type | No-Clean |
| Series | - |
| Type | Solder Paste |
| Mesh Type | 4 |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Mfr | Chip Quik Inc. |
| Package | Bulk |
| Shelf Life | 12 Months |
| Diameter | - |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Base Product Number | TS391S |
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