NXP USA Inc.
Producto No:
OM13497UL
Fabricante:
Paquete:
-
Lote:
-
Descripción:
SURFACE MOUNT TO DIP EVALUATION
Cantidad:
Entrega:
Pago:
Por favor envíe RFQ, responderemos inmediatamente.
Series | - |
Package Accepted | HTSSOP, VFBGA, XFBGA |
Specifications | SMD to DIP |
Number of Positions | 24 |
Kit Type | Adapter, Breakout Boards |
Mfr | NXP USA Inc. |
Quantity | 18 Pieces (3 Values - 6 Each) |
Package | Bulk |
Product Status | Active |
Base Product Number | OM13497 |