FI-XB30SSRL-HF16
JAE Electronics
Producto No:
FI-XB30SSRL-HF16
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
CONN RCPT 30P 0.039 GOLD SMD R/A
Cantidad:
Entrega:
Pago:
En stock : Por favor investigación
Por favor envíe RFQ, responderemos inmediatamente.
Información del producto
Parámetro Info
Guía del usuario
| Insulation Height | - |
| Ingress Protection | - |
| Voltage Rating | 200V |
| Current Rating (Amps) | 1A per Contact |
| Contact Finish Thickness - Mating | 3.90µin (0.099µm) |
| Contact Type | Non-Gendered |
| Material Flammability Rating | UL94 V-0 |
| Product Status | Obsolete |
| Contact Material | Copper Alloy |
| Connector Type | Receptacle |
| Mfr | JAE Electronics |
| Style | Board to Cable/Wire |
| Pitch - Mating | 0.039" (1.00mm) |
| Features | Grounding Pins, Shielded, Solder Retention |
| Contact Finish - Mating | Gold |
| Operating Temperature | -40°C ~ 80°C |
| Number of Rows | 1 |
| Applications | General Purpose |
| Number of Positions | 30 |
| Termination | Solder |
| Fastening Type | Friction Lock |
| Mounting Type | Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount |
| Contact Finish Thickness - Post | - |
| Insulation Material | Plastic |
| Series | FI-X |
| Contact Shape | - |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Insulation Color | Black |
| Contact Length - Post | - |
| Number of Positions Loaded | All |
| Package | Tray |
| Mated Stacking Heights | - |
| Base Product Number | FI-XB30 |
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