ESD-108-G-23

Samtec Inc.

Producto No:

ESD-108-G-23

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Descripción:

CONN SOCKET 16POS 0.1 GOLD PCB

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En stock : 200

Mínimo: 1 Múltiplos: 1

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Insulation Height	0.300" (7.62mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	-
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Type	Female Socket
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Beryllium Copper
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	16
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	10.0µin (0.25µm)
Insulation Material	Liquid Crystal Polymer (LCP)
Series	ESD
Contact Shape	Circular
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Gold
Insulation Color	Black
Contact Length - Post	0.115" (2.92mm)
Number of Positions Loaded	All
Package	Bulk
Mated Stacking Heights	-
Base Product Number	ESD-108