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BDN10-3CB/A01
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BDN10-3CB/A01

CTS Thermal Management Products

Producto No:

BDN10-3CB/A01

Paquete:

-

Lote:

-

Ficha de datos:

pdf

Descripción:

HEATSINK CPU W/ADHESIVE 1.01"SQ

Cantidad:

Entrega:

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Pago:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

En stock : 3591

Mínimo: 1 Múltiplos: 1

Qty

Precio unitario

Precio Ext

  • 1

    $2.3845

    $2.3845

  • 10

    $2.3218

    $23.218

  • 25

    $2.2591

    $56.4775

  • 50

    $2.13351

    $106.6755

  • 100

    $2.008015

    $200.8015

  • 250

    $1.88252

    $470.63

  • 500

    $1.819782

    $909.891

  • 1000

    $1.63153

    $1631.53

  • 5000

    $1.600161

    $8000.805

¿No es el precio que quieres? Envíe RFQ ahora y nos pondremos en contacto con usted lo antes posible.

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Información del producto

Parámetro Info

Guía del usuario

Shape Square, Pin Fins
Material Aluminum
Product Status Active
Fin Height 0.355" (9.02mm)
Series BDN
Type Top Mount
Thermal Resistance @ Forced Air Flow 8.00°C/W @ 400 LFM
Length 1.010" (25.65mm)
Mfr CTS Thermal Management Products
Thermal Resistance @ Natural 26.40°C/W
Material Finish Black Anodized
Package Box
Shelf Life 24 Months
Attachment Method Thermal Tape, Adhesive (Included)
Width 1.010" (25.65mm)
Diameter -
Power Dissipation @ Temperature Rise -
Base Product Number BDN10
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)