BDN09-3CB
CTS Thermal Management Products
Producto No:
BDN09-3CB
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
-
Descripción:
HEATSINK CPU .91" SQ
Cantidad:
Entrega:
Pago:
En stock : 990
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$1.311
$1.311
10
$1.2483
$12.483
25
$1.21562
$30.3905
50
$1.18275
$59.1375
100
$1.11701
$111.701
250
$1.051308
$262.827
500
$0.985606
$492.803
1000
$0.919904
$919.904
5000
$0.887053
$4435.265
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Información del producto
Parámetro Info
Guía del usuario
| Shape | Square, Pin Fins |
| Material | Aluminum |
| Product Status | Active |
| Fin Height | 0.355" (9.02mm) |
| Series | BDN |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
| Length | 0.910" (23.11mm) |
| Mfr | CTS Thermal Management Products |
| Thermal Resistance @ Natural | 26.90°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Width | 0.910" (23.11mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | - |
| Base Product Number | BDN09 |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
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2800+Fabricantes mundiales
15,000 ㎡Almacén en stock
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