Aries Electronics
Producto No:
32-3573-11
Fabricante:
Paquete:
-
Lote:
-
Descripción:
CONN IC DIP SOCKET ZIF 32POS GLD
Cantidad:
Entrega:
Pago:
Por favor envíe RFQ, responderemos inmediatamente.
Contact Finish - Mating | Gold |
Operating Temperature | - |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Current Rating (Amps) | 1 A |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Termination | Solder |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Through Hole |
Product Status | Active |
Number of Positions or Pins (Grid) | 32 (2 x 16) |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Pitch - Post | 0.100" (2.54mm) |
Series | 57 |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Contact Finish - Post | Gold |
Mfr | Aries Electronics |
Pitch - Mating | 0.100" (2.54mm) |
Features | Closed Frame |
Termination Post Length | 0.110" (2.78mm) |
Contact Material - Mating | Beryllium Copper |
Package | Bulk |
Contact Resistance | - |
Base Product Number | 32-3573 |