28-6556-10

Aries Electronics

Producto No:

28-6556-10

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Descripción:

CONN IC DIP SOCKET 28POS GOLD

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En stock : Por favor investigación

Por favor envíe RFQ, responderemos inmediatamente.

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Contact Finish - Mating	Gold
Operating Temperature	-
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	3 A
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	28 (2 x 14)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	6556
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Termination Post Length	0.130" (3.30mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	28-6556