24-6574-10
Aries Electronics
Producto No:
24-6574-10
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
CONN IC DIP SOCKET ZIF 24POS TIN
Cantidad:
Entrega:
Pago:
En stock : 4
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$15.1525
$15.1525
10
$13.43395
$134.3395
25
$12.91734
$322.9335
50
$12.40054
$620.027
100
$11.711695
$1171.1695
250
$10.678266
$2669.5665
500
$9.989364
$4994.682
1000
$9.162646
$9162.646
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Información del producto
Parámetro Info
Guía del usuario
| Contact Finish - Mating | Tin |
| Operating Temperature | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | 200.0µin (5.08µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 57 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Contact Finish - Post | Tin |
| Mfr | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame |
| Termination Post Length | 0.110" (2.78mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Bulk |
| Contact Resistance | - |
| Base Product Number | 24-6574 |
Piezas recomendadas
2000+Volumen de RFQ promedio diario
30,000,000Unidad de producto estándar
2800+Fabricantes mundiales
15,000 ㎡Almacén en stock
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