24-6554-16
Aries Electronics
Producto No:
24-6554-16
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
CONN IC DIP SOCKET ZIF 24POS
Cantidad:
Entrega:
Pago:
En stock : 139
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$46.2555
$46.2555
10
$42.4498
$424.498
25
$40.81732
$1020.433
50
$39.45654
$1972.827
100
$37.279615
$3727.9615
250
$36.1912
$9047.8
¿No es el precio que quieres? Envíe RFQ ahora y nos pondremos en contacto con usted lo antes posible.
Información del producto
Parámetro Info
Guía del usuario
| Contact Finish - Mating | Nickel Boron |
| Operating Temperature | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Finish Thickness - Post | 50.0µin (1.27µm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 55 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Contact Finish - Post | Nickel Boron |
| Mfr | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame |
| Termination Post Length | 0.110" (2.78mm) |
| Contact Material - Mating | Beryllium Copper |
| Package | Bulk |
| Contact Resistance | - |
| Base Product Number | 24-655 |
Piezas recomendadas
2000+Volumen de RFQ promedio diario
30,000,000Unidad de producto estándar
2800+Fabricantes mundiales
15,000 ㎡Almacén en stock
Enlaces rápidos
CopyRight © 道合顺 2013 - 2022 粤ICP备18104022号 粤公网安备 44030402004525号