24-4508-30

Aries Electronics

Producto No:

24-4508-30

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Descripción:

CONN IC DIP SOCKET 24POS GOLD

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En stock : Por favor investigación

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Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 105°C
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Current Rating (Amps)	3 A
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Termination	Wire Wrap
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	24 (2 x 12)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	508
Type	DIP, 0.4" (10.16mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Termination Post Length	0.500" (12.70mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	24-4508