24-3573-16
Aries Electronics
Producto No:
24-3573-16
Fabricante:
Paquete:
-
Lote:
-
Ficha de datos:
Descripción:
CONN IC DIP SOCKET ZIF 24POS
Cantidad:
Entrega:
Pago:
En stock : Por favor investigación
Por favor envíe RFQ, responderemos inmediatamente.
Información del producto
Parámetro Info
Guía del usuario
| Contact Finish - Mating | Nickel Boron |
| Operating Temperature | - |
| Contact Material - Post | Beryllium Nickel |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Current Rating (Amps) | 1 A |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Finish Thickness - Post | 50.0µin (1.27µm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 57 |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Contact Finish - Post | Nickel Boron |
| Mfr | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame |
| Termination Post Length | 0.110" (2.78mm) |
| Contact Material - Mating | Beryllium Nickel |
| Package | Bulk |
| Contact Resistance | - |
| Base Product Number | 24-3573 |
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