24-3570-11

Aries Electronics

Producto No:

24-3570-11

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Descripción:

CONN IC DIP SOCKET ZIF 24POS GLD

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En stock : Por favor investigación

Por favor envíe RFQ, responderemos inmediatamente.

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Contact Finish - Mating	Gold
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	24 (2 x 12)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Pitch - Post	0.100" (2.54mm)
Series	57
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Contact Finish - Post	Gold
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Closed Frame
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	24-3570