22-4513-10H

Aries Electronics

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22-4513-10H

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Descripción:

CONN IC DIP SOCKET 22POS GOLD

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En stock : Por favor investigación

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Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 105°C
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Current Rating (Amps)	3 A
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	22 (2 x 11)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	Lo-PRO®file, 513
Type	DIP, 0.4" (10.16mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Pitch - Mating	0.100" (2.54mm)
Features	Closed Frame
Termination Post Length	0.125" (3.18mm)
Contact Material - Mating	Beryllium Copper
Package	Bulk
Contact Resistance	-
Base Product Number	22-4513