SP2-200X100-G
detaildesc

SP2-200X100-G

BusBoard Prototype Systems

Produkt-Nr.:

SP2-200X100-G

Paket:

-

Charge:

-

Datenblatt:

pdf

Beschreibung:

SMTPADS-2 200X100MIL PADS, TOP-S

Menge:

Lieferung:

1.webp 4.webp 5.webp 2.webp 3.webp

Zahlung:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Material FR4 Epoxy Glass
Size / Dimension 3.94" L x 3.15" W (100.1mm x 80.0mm)
Product Status Active
Series -
Circuit Pattern Pad Per Hole (Rectangular)
Plating Non-Plated Through Hole (NPTH)
Mfr BusBoard Prototype Systems
Proto Board Type Breadboard, General Purpose
Pitch -
Hole Diameter -
Package Bag
Board Thickness 0.063" (1.60mm)
Edge Contacts -