ESQT-130-02-GF-Q-368

Samtec Inc.

Produkt-Nr.:

Hersteller:

Paket:

Charge:

Datenblatt:

Beschreibung:

CONN SOCKET 120P 0.079 GOLD PCB

Menge:

Lieferung:

Zahlung:

Auf Lager : 42

Minimum: 1 Vielfache: 1

Menge

Stückpreis

Ext-Preis

Nicht der Preis, den Sie wollen? Senden Sie jetzt RFQ und wir werden Sie so schnell wie möglich kontaktieren.

Insulation Height	0.368" (9.35mm)
Ingress Protection	-
Voltage Rating	-
Current Rating (Amps)	4.5A per Contact
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Contact Material	Phosphor Bronze
Connector Type	Elevated Socket
Mfr	Samtec Inc.
Style	Board to Board or Cable
Pitch - Mating	0.079" (2.00mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	4
Applications	-
Number of Positions	120
Termination	Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	3.00µin (0.076µm)
Insulation Material	Liquid Crystal Polymer (LCP)
Series	ESQT
Contact Shape	Square
Row Spacing - Mating	0.079" (2.00mm)
Contact Finish - Post	Gold
Insulation Color	Black
Contact Length - Post	0.482" (12.24mm)
Number of Positions Loaded	All
Package	Tube
Mated Stacking Heights	-
Base Product Number	ESQT-130