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5.0mm x 3.2mm 2-Pad Surface Moun
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Menge:
MIC2085-MBQS
Microchip Technology
RP73PF1E26K7BTD
TE Connectivity Passive Product
RN1904,LF(CT
Toshiba Semiconductor and Storage
CC1206JKX7RBBB681
YAGEO
FW-40-02-L-D-425-075
Samtec Inc.
