32-FlatPack, Ceramic Bottom-Brazed
IC EEPROM 4MBIT PAR 32FLATPACK
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Quantity:
W631GG6KB15I TR
Winbond Electronics
PCA13-N
Panduit Corp
745-016-520-206
EDAC Inc.
D55342K07B69B8RTI
Vishay Dale Thin Film
F90/G
J.W. Winco
